{"created":"2023-05-15T14:41:37.614380+00:00","id":70,"links":{},"metadata":{"_buckets":{"deposit":"7638a1c0-8236-4695-8e82-3a3ba0b6d499"},"_deposit":{"created_by":18,"id":"70","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"70"},"status":"published"},"_oai":{"id":"oai:konan-u.repo.nii.ac.jp:00000070","sets":["10:20:31:32"]},"author_link":["289","293","287","290","291","294","288","292"],"item_10002_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2004-07-31","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"1","bibliographicPageEnd":"38","bibliographicPageStart":"29","bibliographicVolumeNumber":"51","bibliographic_titles":[{"bibliographic_title":"甲南大学紀要. 理工学編"},{"bibliographic_title":"Memoirs of Konan University. Science and engineering series","bibliographic_titleLang":"en"}]}]},"item_10002_description_12":{"attribute_name":"論文ID（NAID）","attribute_value_mlt":[{"subitem_description":"110004635731","subitem_description_type":"Other"}]},"item_10002_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"甲南大学"}]},"item_10002_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11561231","subitem_source_identifier_type":"NCID"}]},"item_10002_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13480383","subitem_source_identifier_type":"ISSN"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"metadata only access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_14cb"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Nawafune, Hidemi"}],"nameIdentifiers":[{"nameIdentifier":"287","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kobata, Yuichiro"}],"nameIdentifiers":[{"nameIdentifier":"288","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Morikawa, Yuji"}],"nameIdentifiers":[{"nameIdentifier":"289","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Nawafune, Hidemi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"290","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kobata, Yuichiyo","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"291","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Morikawa, Yuji","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"292","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Akamatsu, Kensuke","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"293","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Murakami, Yoshiki","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"294","nameIdentifierScheme":"WEKO"}]}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"ULSI Metallization","subitem_subject_scheme":"Other"},{"subitem_subject":"Electroless Copper Plating","subitem_subject_scheme":"Other"},{"subitem_subject":"Sn(II) Reducing Agent","subitem_subject_scheme":"Other"},{"subitem_subject":"Deposition Mechanism","subitem_subject_scheme":"Other"},{"subitem_subject":"Characteristics of Copper Film","subitem_subject_scheme":"Other"},{"subitem_subject":"ULSI Metallization","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Electroless Copper Plating","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Sn(II) Reducing Agent","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Deposition Mechanism","subitem_subject_language":"en","subitem_subject_scheme":"Other"},{"subitem_subject":"Characteristics of Copper Film","subitem_subject_language":"en","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization"},{"subitem_title":"Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization","subitem_title_language":"en"}]},"item_type_id":"10002","owner":"18","path":["32"],"pubdate":{"attribute_name":"公開日","attribute_value":"2015-03-24"},"publish_date":"2015-03-24","publish_status":"0","recid":"70","relation_version_is_last":true,"title":["Electroless copper plating using Sn(II) complex as a reducing agent for ULSI metallization"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2023-12-19T06:11:26.232301+00:00"}